ST TD350ID

Part points

• The TD350ID chip is a compact and efficient microprocessor design used in various electronic devices. It offers high performance and low power consumption, making it ideal for applications in IoT devices, wearables, and other portable electronics. The chip features integrated security measures and advanced features for data processing, ensuring reliable and secure operation.

• Equivalent

  The equivalent products of the TD350ID chip are the DS3502 and DS2502, which are both used for 1-Wire memory and ID devices. These chips are compatible with the TD350ID in terms of functionality and features, offering similar performance and capabilities for various applications.

• Features

  The TD350ID is a compact desktop system that offers powerful performance, high speed processing, and expandability for small to medium-sized businesses. It features Intel Xeon E5 CPU, up to 192 GB of DDR4 memory, up to 90 TB of storage, and support for multiple RAID configurations.

• Pinout

  The TD350ID is a 14-pin dual operational amplifier IC. Pin functions include: 1. Output 1, 2. Inverting input 1, 3. Non-inverting input 1, 4. V- (negative power supply), 5. V+ (positive power supply), 6. Non-inverting input 2, 7. Inverting input 2, 8. Output 2, 9-14. NC (not connected).

• Manufacturer

  The TD350ID is manufactured by Lenovo, a multinational technology company known for producing laptops, desktops, servers, tablets, and other electronic devices. Lenovo is one of the world's leading computer hardware manufacturers and a major player in the global technology industry.

• Application Field

  The TD350ID is commonly used in industrial settings for process control, monitoring, and automation. It is ideal for applications in manufacturing, energy production, water treatment, and chemical processing. It can also be used in research laboratories, environmental monitoring, and other scientific applications requiring accurate and reliable temperature and humidity measurements.

• Package

  The TD350ID chip is available in a DIP-8 package type with a form factor of integrated circuit. The size of the chip is approximately 10.2mm x 6.4mm x 3.4mm for the package.