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Infineon S25FL064P0XMFI001
The S25FL064P0XMFI001 is a 64M-bit NOR flash memory device that supports serial interfaces including SPI, Dual SPI, and Quad SPI
Marcas: Infineon
Parte do fabricante #: S25FL064P0XMFI001
Ficha de dados: S25FL064P0XMFI001 Datasheet (PDF)
Pacote/Caso: SOIC-16
Status RoHS:
Condição de estoque: 3.547 peças, novo original
Tipo de Produto: Memória
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
| Quantidade | Preço unitário | Preço Externo |
|---|---|---|
| 1 | $0,269 | $0,269 |
| 200 | $0,104 | $20,800 |
| 500 | $0,100 | $50,000 |
| 1000 | $0,099 | $99,000 |
Em estoque: 3.547 PCS
S25FL064P0XMFI001 Descrição geral
The S25FL064P0XMFI001 is a 64Mb (8MB) serial NOR flash memory device manufactured by Cypress Semiconductor. It offers a range of features suitable for a variety of applications, including industrial, automotive, and consumer electronics.Key details of the S25FL064P0XMFI001 include a high-speed SPI interface with clock frequencies up to 133MHz, allowing for fast read and write operations. It also offers a low power consumption, making it an energy-efficient choice for battery-powered devices.The device has a uniform sector architecture with 64KB sectors, making it easy to manage data storage and retrieval. It also features a flexible software protection mechanism to prevent unauthorized access to data.The S25FL064P0XMFI001 is designed to withstand harsh environments, with a wide operating temperature range of -40°C to 85°C. It also offers high reliability with a minimum of 100,000 program/erase cycles per sector.
Características
- 64 Megabit (8 Megabyte) capacity
- Uniform 4KB sectors for flexible erase capabilities
- High-speed clock rates up to 104MHz
- Low-power operation for extended battery life
- 256 bytes optimal programming size
- Wide operating voltage range of 2.7-3.6V
Aplicativo
- Industrial control systems
- Automotive systems
- Home automation
- Consumer electronics
- Smart meters
- Internet of Things (IoT) devices
- Medical devices
- Data storage devices
- Networking equipment
- Printers and imaging systems
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Family | FL-P | Interface Frequency (SDR/DDR) | 104 / - |
| Interfaces | Quad SPI | Lead Ball Finish | Palladium Plating |
| Operating Temperature max | 85.0 °C | Operating Temperature min | -40.0 °C |
| Operating Voltage max | 3.6 V |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
 |
Transferência bancária | cobrar taxa bancária de US$ 30,00. |
 |
PayPal | cobrar taxa de serviço de 4,0%. |
 |
Cartão de crédito | cobrar taxa de serviço de 3,5%. |
 |
Western Union | charge US.00 banking fee. |
 |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa5 :Caixas de embalagem
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The S25FL064P0XMFI001 chip is a high-performance, low-power Flash memory device manufactured by Cypress Semiconductor. It has a capacity of 64 megabits and operates with a single power supply of 2.7 to 3.6 volts. The chip features a Serial Peripheral Interface (SPI) for communication and can be mounted on a printed circuit board. It is commonly used in various applications such as automotive systems, gaming consoles, and industrial equipment for reliable data storage and quick access.
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Equivalent
Some equivalent products of the S25FL064P0XMFI001 chip include the MX25L6406E, W25Q64FV, and AT25DF641A chips. -
Features
The S25FL064P0XMFI001 is a 64 Mb SPI Flash memory chip. It offers a small form factor, high-speed interface, and low power consumption. It has efficient erase and program algorithms, advanced security features, and high-reliability performance. The chip is ideal for applications that require non-volatile memory storage. -
Pinout
The S25FL064P0XMFI001 is a 64Mb NOR Flash memory chip. It uses an 8-pin SOIC package. The pin count and their functions are as follows: 1. Chip Select (CS) - enables or disables the chip. 2. Serial clock (CLK) - synchronizes data transfer. 3. Serial data input/output (SI/SO) - transfers data. 4. Write enable (W#) - allows or denies write operations. 5. Hold (HOLD#) - suspends ongoing operations. 6. VCC - power supply. 7. Ground (GND). 8. Unused/No-connect pin. -
Manufacturer
The S25FL064P0XMFI001 is manufactured by Cypress Semiconductor Corporation. Cypress Semiconductor is an American semiconductor design and manufacturing company that focuses on developing a wide range of integrated circuits and solutions for various applications, including memory products, microcontrollers, and wireless connectivity solutions. -
Application Field
The application areas of the S25FL064P0XMFI001 include consumer electronics, industrial equipment, automotive systems, and networking devices. It is commonly used for code and data storage in microcontrollers, as well as for firmware updates and system configurations. It offers high performance, reliability, and security features, making it suitable for various embedded and IoT applications. -
Package
The S25FL064P0XMFI001 chip comes in a surface mount package type called SOIC (Small Outline Integrated Circuit). It has a form factor of 200mil, which means it has a width of 0.2 inches. The chip has a size of 8 megabits (1 megabyte) and is manufactured by Cypress Semiconductor Corporation.
Ficha de dados PDF
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These components arrived promptly and worked perfectly in our devices without fail.