PC817X1NSZ1B

Part points

• The PC817X1NSZ1B chip is an optocoupler that contains a gallium arsenide infrared emitting diode and a NPN silicon phototransistor. It is designed to transfer electrical signals between input and output while providing electrical isolation. The chip can be used in various applications such as data communication, digital logic signals, and noise suppression.

• Equivalent

  The equivalent products of the PC817X1NSZ1B chip include PC817, PS817C, TLP281, and EL817. These chips are all optocouplers or photocouplers that provide electrical isolation and signal transmission between different circuits, commonly used for noise reduction and voltage isolation applications in electronics.

• Features

  The PC817X1NSZ1B is an optocoupler IC. It has a transistor output and phototransistor input. It operates with a forward current of 50mA, offering high isolation voltage of 3750Vrms. The device is suitable for applications requiring high coupling density, with its small package size of 4-pin SOP.

• Pinout

  The PC817X1NSZ1B is a 4-pin photocoupler with a phototransistor output. The pin configuration is as follows: Pin 1 (Emitter), Pin 2 (Collector), Pin 3 (NC - No Connection), Pin 4 (Anode). It is commonly used for isolation, voltage sensing, and general purpose switching applications.

• Manufacturer

  The manufacturer of the PC817X1NSZ1B is a company called Sharp Corporation. Sharp Corporation is a multinational electronics company that specializes in the manufacturing and development of various consumer electronics, such as televisions, mobile phones, home appliances, and electronic components.

• Application Field

  The PC817X1NSZ1B is a low input current phototransistor optically coupled isolator. It is commonly used for signal transmission between circuits with different voltage levels and can be found in applications such as communication equipment, industrial control systems, and power supply monitoring.

• Package

  The PC817X1NSZ1B chip is available in a DIP-4 package type, which refers to a Dual Inline Package with four pins. Its form and size are standard for DIP-4 packages, which typically have a rectangular shape with a width of approximately 6.3 mm and a length of about 9.5 mm.