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$5000
PC28F00BP33EFA
EasyBGA-64(8x10) NOR Flash RoHS
Marcas: MICRON TECHNOLOGY INC
Parte do fabricante #: PC28F00BP33EFA
Ficha de dados: PC28F00BP33EFA Ficha de dados (PDF)
Pacote/Caso: BGA-64
Status RoHS:
Condição de estoque: 6.554 peças, novo original
Tipo de Produto: Memória
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
| Quantidade | Preço unitário | Preço Externo |
|---|---|---|
| 1 | $61,324 | $61,324 |
| 200 | $24,470 | $4894,000 |
| 500 | $23,652 | $11826,000 |
| 1000 | $23,248 | $23248,000 |
Em estoque: 6.554 PCS
PC28F00BP33EFA Descrição geral
When speed and reliability are non-negotiable, the PC28F00BP33EFA flash memory chip delivers on both fronts. Its lightning-fast read and write speeds make data storage and retrieval a seamless process. Equipped with advanced error correction and wear leveling algorithms, this chip goes the extra mile to safeguard your data against corruption and ensure long-lasting performance. The multiple erase and program cycles supported by this chip make it a reliable choice for applications that demand frequent updates and changes
Características
- High-Performance Read, Program and Erase
- – 96 ns initial read access
- – 108 MHz with zero wait-state synchronous burst reads: 7 ns clock-to-data output
- – 133 MHz with zero wait-state synchronous burst reads: 5.5 ns clock-to-data output
- – 8-, 16-, and continuous-word synchronous-burst Reads
- – Programmable WAIT configuration
- – Customer-configurable output driver impedance
- – Buffered Programming: 2.0 μs/Word (typ), 512-Mbit 65 nm
- – Block Erase: 0.9 s per block (typ)
- – 20 μs (typ) program/erase suspend
- Architecture
- – 16-bit wide data bus
- – Multi-Level Cell Technology
- – Symmetrically-Blocked Array Architecture
- – 256-Kbyte Erase Blocks
- – 1-Gbit device: Eight 128-Mbit partitions
- – 512-Mbit device: Eight 64-Mbit partitions
- – 256-Mbit device: Eight 32-Mbit partitions
- – 128-Mbit device: Eight 16-Mbit partitions
- – Read-While-Program and Read-While-Erase
- – Status Register for partition/device status
- – Blank Check feature
- Quality and Reliability
- – Expanded temperature: –30 °C to +85 °C
- – Minimum 100,000 erase cycles per block
- – 65nm Process Technology
- Power
- – Core voltage: 1.7 V - 2.0 V
- – I/O voltage: 1.7 V - 2.0 V
- – Standby current: 60 μA (typ) for 512-Mbit, 65 nm
- – Deep Power-Down mode: 2 μA (typ)
- – Automatic Power Savings mode
- – 16-word synchronous-burst read current: 23 mA (typ) @ 108 MHz; 24 mA (typ) @ 133 MHz
- Software
- – Micron® Flash data integrator (FDI) optimized
- – Basic command set (BCS) and extended command set (ECS) compatible
- – Common Flash interface (CFI) capable
- Security
- – One-time programmable (OTP) space
- 64 unique factory device identifier bits
- 2112 user-programmable OTP bits
- – Absolute write protection: VPP = GND
- – Power-transition erase/program lockout
- – Individual zero latency block locking
- – Individual block lock-down
- Density and packaging
- – 128Mb, 256Mb, 512Mbit, and 1-Gbit
- – Address-data multiplexed and non-multiplexed interfaces
- – 64-Ball Easy BGA
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Obsolete | Ihs Manufacturer | MICRON TECHNOLOGY INC |
| Part Package Code | BGA | Package Description | TBGA, |
| Pin Count | 64 | Reach Compliance Code | |
| ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
| Access Time-Max | 100 ns | Additional Feature | IT ALSO OPERATES IN ASYNCHRONOUS MODE |
| JESD-30 Code | R-PBGA-B64 | JESD-609 Code | e1 |
| Length | 10 mm | Memory Density | 2147483648 bit |
| Memory IC Type | FLASH | Memory Width | 16 |
| Number of Functions | 1 | Number of Terminals | 64 |
| Number of Words | 134217728 words | Number of Words Code | 128000000 |
| Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | -40 °C | Organization | 128MX16 |
| Package Body Material | PLASTIC/EPOXY | Package Code | TBGA |
| Package Shape | RECTANGULAR | Package Style | GRID ARRAY, THIN PROFILE |
| Parallel/Serial | PARALLEL | Programming Voltage | 3 V |
| Seated Height-Max | 1.2 mm | Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.3 V | Supply Voltage-Nom (Vsup) | 3 V |
| Surface Mount | YES | Technology | CMOS |
| Temperature Grade | INDUSTRIAL | Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL | Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
 |
Transferência bancária | cobrar taxa bancária de US$ 30,00. |
 |
PayPal | cobrar taxa de serviço de 4,0%. |
 |
Cartão de crédito | cobrar taxa de serviço de 3,5%. |
 |
Western Union | charge US.00 banking fee. |
 |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa3 :Saco antiestático
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The PC28F00BP33EFA is a 32-megabit flash memory chip designed for use in various electronic devices, such as smartphones, tablets, and IoT devices. It offers high-speed data transfer, low power consumption, and reliable data storage capabilities, making it a popular choice for manufacturers looking to add storage flexibility to their products.
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Equivalent
Some equivalent products of the PC28F00BP33EFA chip include the ES28F00BP33EFA, IM28F00BP33EFA, and ST28F00BP33EFA chips. These are all comparable in terms of functionality and performance, making them suitable replacements for the PC28F00BP33EFA in various applications. -
Features
1. 2Gb NAND Flash memory 2. Low power consumption 3. Wide temperature range (-40°C to 85°C) 4. Advanced command set for enhanced operation 5. High reliability and endurance 6. Compatible with various applications such as automotive, industrial, and networking devices. -
Pinout
The PC28F00BP33EFA is a 32Mb (4MB) Parallel NOR Flash Memory with 44-pin TSOP package. It has 44 pins, with functions including power supply, address inputs, data inputs/outputs, control inputs, and write enable pins. -
Manufacturer
The manufacturer of the PC28F00BP33EFA is Intel Corporation. Intel Corporation is an American multinational corporation that designs and manufactures computer processors, motherboards, and other computer hardware components. They are a leading supplier of microprocessors for personal computers and servers. -
Application Field
The PC28F00BP33EFA is commonly used in applications such as automotive systems, industrial automation, and networking equipment. It is suitable for use in embedded systems requiring high-performance, high-density non-volatile memory, and optimal reliability. -
Package
The PC28F00BP33EFA chip comes in a TSOP package. It is in the form of a surface-mount memory module. The size of the chip is 48mm x 20.6mm x 1.2mm.
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