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$5000NBA3N012CSNT1G
0/1 Receiver LVDS SOT-23-5
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Marcas: onsemi
Parte do fabricante #: NBA3N012CSNT1G
Ficha de dados: NBA3N012CSNT1G Ficha de dados (PDF)
Pacote/Caso: SOT-23-5
Tipo de Produto: Drivers, Receivers, Transceivers
Status RoHS:
Condição de estoque: 9.458 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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NBA3N012CSNT1G Descrição geral
Designed to meet the stringent requirements of high data rate automotive applications, the NBA3N012C serves as a dependable single LVCMOS output differential line receiver. Featuring a data rate capacity surpassing 400 Mbps or 200 MHz, this device ensures the seamless transmission of signals in fast-paced environments. By directly accepting LVDS signals as input and converting them to LVCMOS output levels, the NBA3N012C simplifies signal processing tasks for automotive communication systems. Additionally, the inclusion of an input termination resistor reduces the external component count required for establishing point-to-point interfaces, enhancing the overall efficiency of the setup. Packaged in a compact 5 lead SOT23 package and shipped in quantities of 3000 pcs tape & reel, the NBA3N012C offers a practical and versatile solution for addressing the data rate challenges in automotive communication networks
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Características
- Fully Compliant with EIA−644A Standard
- Data Rate: 800 Mbps
- Integrated Line Termination Resistor of 50 Ohms
- Powder Down High Impedance on LVDS Pins
- Operating Range: VDD = 2.5 V ± 0.1 V
- Temperature Operating Range −20°C to +80°C
Aplicativo
- Efficient power in RF
- Cellular noise reduction
- Communication signal boost
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Manufacturer: | onsemi | Product Category: | LVDS Interface IC |
RoHS: | Details | Type: | Receiver |
Number of Drivers: | 0 Driver | Number of Receivers: | 1 Receiver |
Data Rate: | 400 Mb/s | Input Type: | LVDS |
Output Type: | LVCMOS | Supply Voltage - Max: | 3.6 V |
Supply Voltage - Min: | 3 V | Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 125 C | Mounting Style: | SMD/SMT |
Package / Case: | SOT-23-5 | Qualification: | AEC-Q100 |
Packaging: | MouseReel | Brand: | onsemi |
Operating Supply Current: | 5.4 mA | Pd - Power Dissipation: | 794 mW |
Product: | LVDS Receivers | Product Type: | LVDS Interface IC |
Propagation Delay Time: | 3.5 ns | Series: | NBA3N012C |
Factory Pack Quantity: | 3000 | Subcategory: | Interface ICs |
Unit Weight: | 0.000222 oz |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The NBA3N012CSNT1G chip is a high-performance RF amplifier designed for use in a wide range of wireless communication applications. It offers low noise, high gain, and excellent linearity, making it ideal for use in smartphones, tablets, and other portable devices. The chip also features a small size and low power consumption, making it a cost-effective solution for manufacturers.
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Equivalent
The equivalent products of NBA3N012CSNT1G chip are NBA3N012CBL1G, NBA3N012BBL1G, NBA3N012CVR1G, and NBA3N012BVR1G. These chips are all part of the same series and are pin-to-pin compatible with NBA3N012CSNT1G chip. -
Features
1. High-performance RF power amplifier 2. 791-821 MHz frequency range 3. 1 Watt output power 4. 50 ohm impedance 5. Linear operation 6. SOT89-3 package 7. Operates from a 3.6 V supply voltage 8. Suitable for small cell base stations, repeaters, and other wireless communication applications. -
Pinout
The NBA3N012CSNT1G is a dual-channel 1:2 2nd generation SCSI multiplexer/demultiplexer. It has a pin count of 24 pins. Pin functions include VCC, GND, SDI1, SDI2, SDO1, SDO2, SEL, CLK, and LCS. It is used in SCSI applications to increase the number of devices that can be connected to a single bus. -
Manufacturer
The manufacturer of the NBA3N012CSNT1G is ON Semiconductor. ON Semiconductor is a leading supplier of power management and semiconductor solutions worldwide. They provide a comprehensive portfolio of products for a wide range of applications, including automotive, industrial, and consumer electronics. -
Application Field
The NBA3N012CSNT1G is a high-performance, Silicon Carbide MOSFET designed for power conversion applications in industrial motor drives, electric vehicles, renewable energy systems, and battery charging systems. It offers improved efficiency, reduced system size, and enhanced thermal performance, making it ideal for high-power applications that require high efficiency and reliability. -
Package
The NBA3N012CSNT1G chip comes in a surface-mount chip-scale package with a form factor of 1.2 x 1.2 mm.
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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