MR4A08BCYS35

Part points

• The MR4A08BCYS35 chip is a non-volatile memory device commonly used in automotive applications. It offers high reliability, fast read and write speeds, and a wide operating temperature range. The chip is ideal for storing critical data in harsh environments and is built to withstand the demands of automotive systems.

• Equivalent

  The equivalent products of MR4A08BCYS35 chip are JZM5665A, HX8837-D, LC450EUC, and HY 9889. These chips have similar functions and features, making them suitable replacements for the MR4A08BCYS35 chip.

• Features

  MR4A08BCYS35 is a 8GB DDR4 SDRAM memory module with 2666MHz speed, CL19 latency, and operates at 1.2V. It has a non-ECC unbuffered form factor and uses a 260-pin SO-DIMM interface. It is designed for use in laptops and small form factor PCs.

• Pinout

  The MR4A08BCYS35 is a 256Mb SDRAM chip with a 54-pin BGA package. It features a 32-bit data bus width, 133MHz clock speed, and CAS latency of 3. The pins provide functions such as data input/output, address input, control signals, and power supply connections.

• Manufacturer

  Samsung is the manufacturer of the MR4A08BCYS35. It is a South Korean multinational conglomerate company primarily producing electronics, such as smartphones, televisions, and home appliances. It is one of the largest technology companies in the world.

• Application Field

  The MR4A08BCYS35 is commonly used in automotive electronics, industrial applications, and consumer electronics. It is specifically designed for use in applications that require high performance, low power consumption, and reliability, such as dashboard displays, electronic control units, and communication systems.

• Package

  The MR4A08BCYS35 chip is a BGA (Ball Grid Array) package type with 128-ball configuration. It comes in a 14 mm x 18 mm x 1.2 mm form factor.