Pedidos acima de
$5000MPC7410RX500LE
BGA-packaged ceramic microprocessor with 32-bit architecture and 360 pins
Marcas: Nxp Semiconductors
Parte do fabricante #: MPC7410RX500LE
Ficha de dados: MPC7410RX500LE Ficha de dados (PDF)
Pacote/Caso: FCCBGA
Tipo de Produto: Microprocessors
Status RoHS:
Condição de estoque: 6.629 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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MPC7410RX500LE Descrição geral
Power up your embedded computing tasks with the MPC7410RX500LE microprocessor from Motorola (now Freescale Semiconductor). This cutting-edge processor, based on the PowerPC architecture and RISC design, delivers consistent performance at a clock speed of 500 MHz. Its efficient core design focuses on minimizing power consumption and managing thermal output, making it a reliable choice for embedded systems with diverse requirements. Equipped with integrated memory controllers, the MPC7410RX500LE ensures efficient data access and transfer speeds, while its connectivity options allow for seamless integration into various embedded environments. Whether you need a solution that prioritizes reliability, efficiency, or moderate computational power, the MPC7410RX500LE has you covered
Características
- Precision temperature control
- Power management features optimized
- Compact design for mobile devices
Aplicativo
- Automotive integration
- Avionics potential
- High reliability
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
ECCN (US) | 3A991a.1. | Part Status | Obsolete |
HTS | 8542.31.00.01 | SVHC | Yes |
SVHC Exceeds Threshold | Yes | Automotive | No |
PPAP | No | Family Name | PowerPC MPC74xx Processor |
Instruction Set Architecture | RISC | Device Core | PowerPC |
Number of CPU Cores | 1 | Data Bus Width (bit) | 32 |
Instruction Cache Size | 32KB | Maximum Speed (MHz) | 500 |
UART | 0 | USART | 0 |
Data Cache Size | 32KB | USB | 0 |
Multiply Accumulate | No | SPI | 0 |
I2C | 0 | I2S | 0 |
CAN | 0 | Ethernet | 0 |
Minimum Operating Supply Voltage (V) | 1.7 | Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.9 | I/O Voltage (V) | 1.8|2.5|3.3 |
Minimum Operating Temperature (°C) | 0 | Maximum Operating Temperature (°C) | 105 |
Packaging | Tray | Mounting | Surface Mount |
Package Height | 2.2(Max) | Package Width | 25 |
Package Length | 25 | PCB changed | 360 |
Standard Package Name | BGA | Supplier Package | FCCBGA |
Pin Count | 360 |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The MPC7410RX500LE is a microprocessor chip developed by Motorola. It is a high-performance, PowerPC-based chip designed for embedded applications such as networking and telecommunications equipment. With a clock speed of 500 MHz, it offers advanced processing capabilities and low power consumption, making it suitable for use in a variety of embedded systems.
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Equivalent
The equivalent products of MPC7410RX500LE chip are: 1. MPC7410RX500LE2: A slightly upgraded version of the original chip. 2. Freescale MPC7400RX500LE: A similar chip produced by Freescale, which also has a 500MHz clock speed and is based on the same PowerPC architecture. -
Features
The MPC7410RX500LE is a single-core PowerPC microprocessor with a clock speed of 500 MHz. It features a 32 KB instruction and 32 KB data L1 cache, as well as a 512 KB L2 cache. It also includes a 64-bit PowerPC architecture, a 64-bit memory interface, and can support up to 4 GB of DDR memory. -
Pinout
The MPC7410RX500LE is a 360-pin BGA (Ball Grid Array) package with a 500 MHz clock speed. It is a PowerPC microprocessor with a 32-bit instruction set and is designed for embedded computing applications. It features a dual-core architecture and is capable of handling complex computing tasks with low power consumption. -
Manufacturer
The manufacturer of the MPC7410RX500LE is Freescale Semiconductor. It is a company that designs and manufactures embedded processing solutions for automotive, industrial, networking, consumer and wireless markets. -
Application Field
The MPC7410RX500LE is a PowerPC microprocessor designed for embedded applications such as in telecommunication, networking, and automotive control systems. Its high performance and low power consumption make it suitable for use in devices that require real-time processing and advanced computation capabilities. -
Package
The MPC7410RX500LE chip comes in a 360-contact metallic ball grid array (PBGA) package. It is a flip-chip form with a size of 35.5mm x 35.5mm.
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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