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$5000NXP MPC5566
NXP 32-bit MCU, Power Arch core, 3MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416
Marcas: NXP Semiconductor
Parte do fabricante #: MPC5566
Ficha de dados: MPC5566 Ficha de dados (PDF)
Pacote/Caso: SOT1705-1
Status RoHS:
Condição de estoque: 3.160 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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MPC5566 Descrição geral
The MPC5566 is a microcontroller unit (MCU) manufactured by NXP Semiconductors, which is now part of ON Semiconductor. The MPC5566 is part of the Power Architecture family of microcontrollers and is designed for a wide range of automotive and industrial applications that require high-performance processing capabilities and advanced control features.
Absolute Maximum Ratings
Características
Core: The MPC5566 is based on the Power Architecture e200z6 core, which is a 32-bit RISC processor core designed for embedded control applications.
Clock Speed: It typically operates at clock speeds of up to 132 MHz, providing the processing power required for real-time control and data processing tasks.
Memory: The MCU includes on-chip Flash memory for program storage and SRAM for data storage. The specific memory sizes may vary depending on the version or configuration.
Peripherals: The MPC5566 is equipped with a wide range of peripheral interfaces and features, including multiple CAN (Controller Area Network) interfaces, FlexRay, Ethernet, UARTs, SPI (Serial Peripheral Interface), I2C (Inter-Integrated Circuit), PWM (Pulse-Width Modulation) controllers, and more. These peripherals make it suitable for automotive and industrial communication and control applications.
Safety and Reliability: It may include features like error correction codes (ECC) in memory, hardware support for functional safety standards (e.g., ISO 26262), and built-in self-test (BIST) capabilities to enhance system reliability.
Operating Temperature: The MPC5566 is designed to operate in a wide temperature range, making it suitable for automotive and industrial environments with varying temperature conditions.
Power Management: It includes power management features to optimize energy efficiency and reduce power consumption in battery-operated and power-sensitive applications.
Development Tools: NXP provides development tools, including software development kits (SDKs), integrated development environments (IDEs), and evaluation boards, to aid in the development of applications using the MPC5566.
Aplicativo
Automotive Applications:
Engine Control Units (ECUs): MPC5566 is frequently used in ECUs to precisely control the operation of internal combustion engines. It manages tasks such as fuel injection timing, ignition timing, and emission control, contributing to improved engine efficiency and reduced emissions.
Transmission Control: In automatic and semi-automatic transmissions, the MPC5566 helps manage gear shifting, torque converter lockup, and other critical functions for smooth and efficient vehicle operation.
Chassis Control: It plays a pivotal role in chassis control systems, including antilock braking systems (ABS), electronic stability control (ESC), and traction control, ensuring vehicle stability and safety.
Advanced Driver-Assistance Systems (ADAS): MPC5566 is used in ADAS applications, which encompass features like adaptive cruise control, lane-keeping assistance, collision avoidance, and parking assistance. These systems rely on real-time data processing and control to enhance driver safety and comfort.
Industrial Control Applications:
Factory Automation: In factory automation and control systems, the MPC5566 aids in controlling machinery, robots, conveyors, and other equipment, optimizing manufacturing processes, and improving productivity.
Robotics: Robots demand precise control and sensor integration for tasks ranging from assembly and welding to material handling. The MPC5566 assists in achieving the required accuracy and responsiveness.
Motor Control: It's utilized in motor control applications, including servo drives, stepper motor control, and industrial pumps, where precise speed and position control are essential.
Process Control: In industrial process control systems, the MPC5566 helps regulate variables like temperature, pressure, flow rate, and chemical composition, ensuring consistent and reliable processes.
IoT and Smart Manufacturing: As industries move towards IoT and smart manufacturing, the MPC5566 supports the integration of sensors, connectivity, and data processing to enable predictive maintenance and efficient resource utilization.
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| place | launch_date | ||
| last_inspection_date | +90 | rohs_version | |
| supplier_cage_code | htsusa | ||
| schedule_b | ppap | ||
| aec |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
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Part points
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The MPC5566 chip is a high-performance microcontroller unit (mcu) developed by nxp semiconductors. it features a power architecture-based core and is commonly used in automotive applications. with its integrated peripherals and enhanced connectivity options, the MPC5566 offers advanced features, real-time performance, and robust security.
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Equivalent
There are no direct equivalent products of the MPC5566 chip, as it is a specific microcontroller developed by nxp semiconductors. however, other microcontrollers from nxp's mpc55xx series, such as the mpc5567 or mpc5561, may offer similar features and capabilities. -
Features
The MPC5566 is a microcontroller with a 32-bit power architecture® core. it features a high-performance digital signal processor (dsp) and floating-point unit (fpu), providing fast computation capabilities. it also includes a variety of communication interfaces, such as can, flexray, and ethernet, for efficient data transfer and connectivity. additionally, it offers a range of on-chip peripherals and memory options for versatile application development. -
Pinout
The MPC5566 is a microcontroller with a pin count of 208. it is used in automotive applications and provides high-performance computing capabilities. the pins serve various functions, including gpio, memory interfaces, communication interfaces (such as can, lin, and flexray), timers, and adc inputs. -
Manufacturer
The manufacturer of the MPC5566 is nxp semiconductors. nxp is a multinational semiconductor and technology company. it specializes in the design and production of embedded processors, microcontrollers, and other electronic components for various industries including automotive, industrial, and consumer electronics. -
Application Field
The MPC5566 microcontroller is commonly used in automotive applications such as engine management, powertrain control, and advanced driver assistance systems. it is also suitable for industrial control systems, motor control, and various other applications requiring high performance and reliable real-time processing. -
Package
The MPC5566 chip is offered in a package type known as fcpbga, which stands for fine-pitch ball grid array. it has a form factor referred to as 516-lfbga and measures 23mm x 23mm in size.
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