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$5000ON MOCD223M
Optoisolator Darlington Output 2500Vrms 2 Channel 8-SOIC
Marcas: ON Semiconductor, LLC
Parte do fabricante #: MOCD223M
Ficha de dados: MOCD223M Datasheet (PDF)
Pacote/Caso: SOIC-8
Tipo de Produto: Transistor, Photovoltaic Output Optoisolators
Status RoHS:
Condição de estoque: 2.007 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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MOCD223M Descrição geral
When it comes to reliable and efficient optocoupler devices, the MOCD223M stands out as a top-notch choice for various high-speed data transmission and isolation applications. Its unique design, featuring a gallium arsenide infrared emitting diode and a silicon phototransistor, offers exceptional electrical isolation to protect sensitive components from voltage spikes and noise. Whether in industrial or automotive settings, this device excels in providing stable performance over a wide temperature range, making it a versatile solution for challenging environments. Its compact package size allows for easy integration into compact circuit designs, further enhancing its usability and flexibility
Características
- Low Input Current and High Output Current Capability
- Compact Surface Mount Package with Easy Mounting
- Frequency Response up to 5 MHz Guaranteed
Aplicativo
- Fiber-optic communication
- Ethernet networks
- Industrial automation
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Source Content uid | MOCD223M | Pbfree Code | Yes |
| Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
| Package Description | SOIC-8 | Manufacturer Package Code | 751DZ |
| Reach Compliance Code | compliant | HTS Code | 8541.40.80.00 |
| Factory Lead Time | 40 Weeks | Samacsys Manufacturer | onsemi |
| Additional Feature | UL RECOGNIZED | Coll-Emtr Bkdn Voltage-Min | 30 V |
| Configuration | SEPARATE, 2 CHANNELS | Current Transfer Ratio-Min | 500% |
| Current Transfer Ratio-Nom | 1000% | Dark Current-Max | 50 nA |
| Forward Current-Max | 0.06 A | Forward Voltage-Max | 1.3 V |
| Isolation Voltage-Max | 2500 V | JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT | Number of Elements | 2 |
| On-State Current-Max | 0.15 A | Operating Temperature-Max | 100 °C |
| Operating Temperature-Min | -40 °C | Optoelectronic Device Type | DARLINGTON OUTPUT OPTOCOUPLER |
| Power Dissipation-Max | 0.15 W | Surface Mount | YES |
| Terminal Finish | MATTE TIN | Package | Tube |
| Product Status | Active | Number of Channels | 2 |
| Voltage - Isolation | 2500Vrms | Current Transfer Ratio (Min) | 500% @ 1mA |
| Turn On / Turn Off Time (Typ) | 10µs, 125µs | Rise / Fall Time (Typ) | 8µs, 110µs |
| Input Type | DC | Output Type | Darlington |
| Voltage - Output (Max) | 30V | Current - Output / Channel | 150mA |
| Voltage - Forward (Vf) (Typ) | 1.25V | Current - DC Forward (If) (Max) | 60 mA |
| Vce Saturation (Max) | 1V | Operating Temperature | -40°C ~ 100°C |
| Mounting Type | Surface Mount | Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Supplier Device Package | 8-SOIC |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
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Part points
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The MOCD223M is a chip used in optocoupler applications. It consists of a phototransistor optically coupled to a gallium arsenide infrared-emitting diode. It provides high-density mounting capabilities with low input-output capacitance, making it suitable for applications requiring high-speed operation and reduced power consumption. The chip effectively isolates two circuits while allowing electrical signal transfer by converting electrical signals into light signals.
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Equivalent
There are no direct equivalent products of the MOCD223M chip available. However, possible alternative options may include other optocoupler ICs with similar specifications and functionality, such as the PC123, H11AA1, or TLP3547. Please consult datasheets for compatibility and suitability for specific applications. -
Features
The MOCD223M is a high-speed phototransistor optocoupler with photodiode and a fast base-emitter diode. It offers high noise immunity, high isolation voltage, and a wide operating temperature range. The device is suitable for applications such as feedback control circuits, power supplies, and file servers. -
Pinout
The MOCD223M is an optocoupler device with 8 pins. It is used for electrical isolation and signal transmission between two circuits. The pin functions include anode, cathode, collector, emitter, base, detector cathode, detector anode, and no-connect. -
Manufacturer
The manufacturer of the MOCD223M is Fairchild Semiconductor. It is a semiconductor manufacturing company, specializing in the production and development of power management applications, as well as analog and display solutions. -
Application Field
The MOCD223M is primarily used in applications that require high-speed switching and isolation, such as motor controls, power supplies, and solid-state relays. It is commonly employed in industries such as automotive, industrial automation, and telecommunications. -
Package
The MOCD223M chip is available in a DIP-6 package type, which stands for Dual In-line Package. It has a through-hole mounting form, and the size of the chip is 8.89mm x 6.60mm x 3.81mm.
Ficha de dados PDF
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