ST M48T35Y-70MH1F

Part points

• The M48T35Y-70MH1F chip is a non-volatile, low-power CMOS real-time clock (RTC) with integrated 32 KHz crystal oscillator. It operates as a clock/calendar and provides accurate timekeeping for various applications. The chip features a battery backup for data retention during power loss and offers advanced features such as programmable alarm, periodic interrupt, and automatic power-fail chip deselect. It is commonly used in embedded systems, communication equipment, and industrial applications.

• Equivalent

  The equivalent products of the M48T35Y-70MH1F chip are the DS12885 and the PCF8583 chips, which are also real-time clock (RTC) modules with non-volatile RAM. They function similarly and can be used as replacements.

• Features

  The M48T35Y-70MH1F is a timekeeper RAM with a non-volatile built-in lithium power source. It has a battery backup that enables continuous timekeeping and operation in the absence of power. With a small package and low power consumption, it offers reliable timekeeping capabilities for various applications.

• Pinout

  The M48T35Y-70MH1F is a 28-pin DIP real-time clock (RTC) module. It provides time-keeping functions backed by a lithium battery to retain data during power loss. The pin count includes power supply, address, data, control, and crystal connections along with pins for battery backup and chip enable functions.

• Manufacturer

  STMicroelectronics is the manufacturer of the M48T35Y-70MH1F. It is a global semiconductor company specializing in designing, manufacturing, and marketing a range of electronic products.

• Application Field

  The M48T35Y-70MH1F is commonly used in application areas that require a non-volatile timekeeping solution with integrated lithium battery backup. Examples include industrial automation, telecommunications equipment, medical devices, and various embedded systems that rely on accurate timekeeping even when the main power is disconnected.

• Package

  The M48T35Y-70MH1F chip comes in a 44-lead SOIC (Small Outline Integrated Circuit) package. Its form factor is rectangular, and its size is approximately 10.3mm x 22.5mm x 3.8mm.