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$5000Microchip M2S090T-1FG676I
Family with 86184 Cells
Marcas: Microchip Technology
Parte do fabricante #: M2S090T-1FG676I
Ficha de dados: M2S090T-1FG676I Ficha de dados (PDF)
Pacote/Caso: BGA-676
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2.542 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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M2S090T-1FG676I Descrição geral
In the realm of FPGA devices, the M2S090T-1FG676I from Microchip is a standout choice for its comprehensive feature set and proven reliability. Whether used for tasks like input/output expansion, bridging functions, or secure connectivity, this device offers a versatile solution for a variety of applications. With support for PCIe Gen2 and a low power consumption of 70mW per 5G SERDES, the FPGA device delivers high performance while minimizing energy usage. Moreover, the device's security features protect against unauthorized access and ensure the integrity of the system, making it a trusted choice for critical applications in industries like Defense and Aviation
Características
- Safety and Reliability
- Fail-safe design for high-reliability applications
- Redundancy and fault detection mechanisms
- Error correction codes and data integrity checking
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Manufacturer: | Microchip | Product Category: | SoC FPGA |
| RoHS: | N | Mounting Style: | SMD/SMT |
| Package / Case: | BGA-676 | Core: | ARM Cortex M3 |
| Number of Cores: | 1 Core | Maximum Clock Frequency: | 166 MHz |
| L1 Cache Instruction Memory: | - | L1 Cache Data Memory: | - |
| Program Memory Size: | 512 kB | Data RAM Size: | 64 kB |
| Number of Logic Elements: | 86316 LE | Brand: | Microchip Technology |
| Moisture Sensitive: | Yes | Number of Logic Array Blocks - LABs: | 7193 LAB |
| Packaging: | Tray | Product Type: | SoC FPGA |
| Series: | SmartFusion2 | Factory Pack Quantity: | 40 |
| Subcategory: | SOC - Systems on a Chip | feature-maximum-internal-frequency-mhz | |
| feature-process-technology | 65nm | feature-minimum-operating-supply-voltage-v | 1.14 |
| feature-device-system-gates | feature-maximum-operating-supply-voltage-v | 1.26 | |
| feature-programmability | Yes | feature-maximum-propagation-delay-time-ns | |
| feature-packaging | Tray | feature-maximum-operating-frequency-mhz | |
| feature-rad-hard | feature-pin-count | 676 | |
| feature-supplier-package | FBGA | feature-standard-package-name1 | BGA |
| feature-cecc-qualified | No | feature-esd-protection | |
| feature-escc-qualified | feature-military | No | |
| feature-aec-qualified | No | feature-aec-qualified-number | |
| feature-auto-motive | No | feature-p-pap | No |
| feature-eccn-code | 3A991.d. | feature-svhc | |
| feature-svhc-exceeds-threshold | No | Series | SmartFusion®2 |
| Package | Tray | Product Status | Active |
| Architecture | MCU, FPGA | Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB | RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES | Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Speed | 166MHz | Primary Attributes | FPGA - 90K Logic Modules |
| Operating Temperature | -40°C ~ 100°C (TJ) | Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) | Number of I/O | 425 |
| Base Product Number | M2S090 |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
 |
Transferência bancária | cobrar taxa bancária de US$ 30,00. |
 |
PayPal | cobrar taxa de serviço de 4,0%. |
 |
Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The M2S090T-1FG676I chip is a high-performance FPGA (Field-Programmable Gate Array) manufactured by Microchip Technology. It features 90,000 logic cells, 268 user I/O pins, and a compact 676-pin package. This chip offers programmable logic, memory, and high-speed interfaces, making it suitable for a wide range of embedded applications.
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Equivalent
The equivalent products of M2S090T-1FG676I chip are Xilinx Spartan-3 FPGA family, specifically XC3S1000-4FG676C and XC3S2000-4FG676C. These chips offer similar capabilities and performance for FPGA applications. -
Features
The M2S090T-1FG676I is a Field Programmable Gate Array (FPGA) with 90,000 logic elements, 3,520 kbits of embedded memory, and 58 embedded multiplier blocks. It also features 150 user I/Os, multiple high-speed transceivers, and advanced system-level power management capabilities. -
Pinout
The M2S090T-1FG676I has a pin count of 676. This FPGA (Field-Programmable Gate Array) is designed for high-performance applications and includes features such as logic blocks, memory blocks, and digital signal processing blocks, making it suitable for a wide range of functions including data processing, communication, and industrial automation. -
Manufacturer
The manufacturer of the M2S090T-1FG676I is Microsemi Corporation. It is a provider of semiconductor and system solutions for aerospace & defense, communications, data center, and industrial markets. The company specializes in developing high-performance, reliable, and cutting-edge technology solutions for a wide range of applications. -
Application Field
The M2S090T-1FG676I is commonly used in various industrial applications such as robotics, automation, telecommunication, and consumer electronics due to its high performance and low power consumption. It is also used in automotive systems, medical devices, and military equipment for reliable and efficient operation. -
Package
The M2S090T-1FG676I chip comes in a Ball Grid Array (BGA) package, has a form factor of 676 pins, and a size of 17mm x 17mm.
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