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$5000NXP LPC2134FBD64/01
MCU 16-bit/32-bit ARM7TDMI-S RISC 128KB Flash 3.3V 64-Pin LQFP
Marcas: NXP Semiconductor
Parte do fabricante #: LPC2134FBD64/01
Ficha de dados: LPC2134FBD64/01 Ficha de dados (PDF)
Pacote/Caso: LQFP-64
Tipo de Produto: Microcontrollers
Status RoHS:
Condição de estoque: 3.773 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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LPC2134FBD64/01 Descrição geral
IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64, Microcontroller
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Source Content uid | LPC2134FBD64/01 | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | NXP SEMICONDUCTORS | Part Package Code | QFP |
Package Description | 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64 | Pin Count | 64 |
Reach Compliance Code | compliant | ECCN Code | 3A991.A.2 |
HTS Code | 8542.31.00.01 | Has ADC | YES |
Address Bus Width | 8 | Bit Size | 32 |
CPU Family | ARM7 | Clock Frequency-Max | 60 MHz |
DAC Channels | YES | DMA Channels | NO |
External Data Bus Width | 8 | JESD-30 Code | S-PQFP-G64 |
JESD-609 Code | e3 | Length | 10 mm |
Moisture Sensitivity Level | 1 | Number of I/O Lines | 47 |
Number of Terminals | 64 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | PWM Channels | YES |
Package Body Material | PLASTIC/EPOXY | Package Code | LFQFP |
Package Equivalence Code | QFP64,.47SQ,20 | Package Shape | SQUARE |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
Qualification Status | Not Qualified | RAM (bytes) | 16384 |
ROM (words) | 131072 | ROM Programmability | FLASH |
Seated Height-Max | 1.6 mm | Speed | 60 MHz |
Supply Voltage-Max | 3.6 V | Supply Voltage-Min | 3 V |
Supply Voltage-Nom | 3.3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN | Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm | Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 10 mm |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | Product Category | ARM Microcontrollers - MCU |
Series | LPC2000 | Mounting Style | SMD/SMT |
Package / Case | LQFP-64 | Core | ARM7TDMI-S |
Program Memory Size | 128 kB | Data Bus Width | 32 bit/16 bit |
ADC Resolution | 10 bit | Maximum Clock Frequency | 60 MHz |
Number of I/Os | 47 I/O | Data RAM Size | 16 kB |
Supply Voltage - Min | 3 V | Supply Voltage - Max | 3.6 V |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 85 C |
Brand | NXP Semiconductors | DAC Resolution | 10 bit |
Height | 1.4 mm | Interface Type | I2C, SPI, SSP, UART |
Number of ADC Channels | 8 Channel | Number of Timers/Counters | 2 Timer |
Product Type | ARM Microcontrollers - MCU | Program Memory Type | Flash |
Subcategory | Microcontrollers - MCU |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The LPC2134FBD64/01 is a 16-bit/32-bit ARM microcontroller from NXP Semiconductors. It features a high-performance ARM7TDMI-S core running at up to 60MHz, 512KB of flash memory, 32KB of RAM, and a range of peripherals including UART, SPI, I2C, and ADC. It is commonly used in embedded systems, industrial automation, and communication applications.
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Equivalent
The LPC2134FBD64/01 chip can be replaced by LPC2132FBD64/01 or LPC2137FBD64/01. These chips are all from the same LPC2100 series of microcontrollers by NXP Semiconductors, with similar features and capabilities. -
Features
The LPC2134FBD64/01 is a 16/32-bit ARM7TDMI-S microcontroller with 128 kB flash memory, 16 kB SRAM, 10-bit ADC, UART, SPI, I2C, PWM, and USB interfaces. It operates at a maximum frequency of 60 MHz, has an embedded bootloader for in-system programming, and supports up to 3 external memory banks. -
Pinout
The LPC2134FBD64/01 is a 64-pin microcontroller with 128 KB of flash memory. It features multiple digital and analog I/O pins, UART, SPI, I2C, ADC, PWM, and timers for communication and control applications. -
Manufacturer
NXP Semiconductors is the manufacturer of the LPC2134FBD64/01. It is a global semiconductor company that focuses on designing and manufacturing a wide range of products for various industries, including automotive, industrial, consumer, and computing. NXP's products are used in a variety of applications such as mobile devices, smart appliances, and automotive systems. -
Application Field
The LPC2134FBD64/01 is commonly used in embedded systems, industrial automation, robotics, consumer electronics, and communication applications. It is suitable for a wide range of applications such as motor control, data communication, sensor interfacing, control systems, and more due to its high-performance ARM7TDMI-S core and versatile peripheral features. -
Package
The LPC2134FBD64/01 chip is available in a 64-pin LQFP package with a form factor of Dual In-Line Package (DIP). The dimensions of the package are 10mm x 10mm x 1.4mm.
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