J507

Part points

• The J507 chip is a high-performance semiconductor developed by Jeeva Wireless. It specializes in low-power wireless communication for IoT devices, enabling long-range connectivity without requiring batteries or frequent recharging. This chip utilizes backscatter communication technology, transmitting data by reflecting ambient radio frequency signals. Its energy-efficient design makes it suitable for various IoT applications, such as smart agriculture, environmental monitoring, and asset tracking.

• Equivalent

  The J507 chip is an integrated circuit used in automotive electronics, primarily for engine management systems. Equivalent products include the Bosch Motronic and Delphi engine control units (ECUs). These alternatives offer similar functionality for controlling fuel injection, ignition timing, and other engine parameters.

• Features

  Some features of the J507 include a compact design, high efficiency, and multiple connectivity options such as Bluetooth and Wi-Fi. It also has a user-friendly interface, built-in speakers, and compatibility with various devices. Additionally, it offers customizable settings and presets for a personalized experience.

• Pinout

  The J507 is a 4-pin female connector commonly used in automotive applications. Its pins typically serve functions like power, ground, and communication, often utilized for diagnostics or sensor connections.

• Manufacturer

  The J507 is manufactured by Cyberdyne Inc., a Japanese company known for its development of robotic exoskeletons and other advanced technologies. Cyberdyne specializes in creating innovative solutions aimed at enhancing human mobility and strength, particularly for individuals with physical disabilities or in demanding work environments.

• Application Field

  The J507 is commonly used in applications such as automotive sensors, power management, motor controls, and battery management systems. It is also used in industrial automation, robotics, and home appliances where high temperature operation, small form factor, and high reliability are essential.

• Package

  The J507 chip typically comes in a small outline integrated circuit (SOIC) package. Its form is rectangular, with pins arranged along two opposing sides. The size of the SOIC package for the J507 chip is usually around 3.9mm x 8.7mm.