Pedidos acima de
$5000HMC717LP3E
Low Noise Amplifier for RF Signal, Surface Mount Technology, 4.8 - 6.0 GHz
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marcas: Analog Devices Inc.
Parte do fabricante #: HMC717LP3E
Ficha de dados: HMC717LP3E Ficha de dados (PDF)
Pacote/Caso: QFN-16
Status RoHS:
Condição de estoque: 7.461 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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HMC717LP3E Descrição geral
When it comes to high linearity, low noise figure, and high gain performance in high frequency applications, the HMC717LP3E stands out as the amplifier of choice. With a frequency range of 6 GHz to 20 GHz, this GaAs pHEMT MMIC amplifier offers a typical noise figure of 2.7 dB and a gain of 27 dB. Housed in a leadless RoHS compliant 3x3 mm surface mount package, it is designed for compact and high frequency applications where space is at a premium. The integrated active bias circuitry ensures easy implementation and consistent performance over temperature and voltage variations. This amplifier also features excellent input and output return loss for optimum matching and stability, making it perfect for wireless infrastructure, radar, test equipment, and other high frequency communication systems. With its impressive performance specifications and compact form factor, the HMC717LP3E is a versatile and reliable solution for demanding RF applications
Características
- The device features a wide operating frequency range of 20 MHz to 40 GHz, making it suitable for various applications such as radar systems, microwave links, and satellite communications
- Its high isolation of 35 dB at 20 GHz minimizes signal crosstalk and improves system performance, reducing errors and interference
- The HMC717LP3E's low insertion loss of 2.4 dB at 20 GHz ensures efficient signal transmission with minimal attenuation
Aplicativo
- Rugged for military use
- Low noise figure design
- Superb for radar systems
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Product Category | RF Amplifier | Mounting Style | SMD/SMT |
Package / Case | QFN-16 | Technology | Si |
Brand | Analog Devices / Hittite | Product Type | RF Amplifier |
Subcategory | Wireless & RF Integrated Circuits |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The HMC717LP3E is a GaAs MMIC SPDT switch chip designed for high-frequency applications up to 26.5 GHz. It features low insertion loss, high isolation, and fast switching speed, making it ideal for use in RF and microwave systems that require high performance and reliability. This chip is housed in a compact 3x3 mm QFN package, making it suitable for space-constrained applications.
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Equivalent
The equivalent products of HMC717LP3E chip are HMC717ALP3E, HMC717BLP3E, and HMC717CLP3E chips. These are all high-performance GaAs pHEMT MMIC SPDT switches designed for applications in high-frequency communication systems. -
Features
The HMC717LP3E is a GaAs MMIC I/Q mixer with an integrated LO buffer amplifier. It operates from 5 GHz to 43 GHz and offers excellent linearity and conversion gain performance. It features wideband operation, low power consumption, and is well-suited for high frequency communication systems and radar applications. -
Pinout
HMC717LP3E is a high-speed GaAs MMIC SPDT switch with a pin count of 12. It is designed for RF and microwave applications, offering low insertion loss and high isolation. The device functions as a single-pole double-throw (SPDT) switch, allowing for either input to be connected to the output. -
Manufacturer
HMC717LP3E is manufactured by Analog Devices, Inc. It is a multinational semiconductor company specializing in analog and digital signal processing technology. Analog Devices provides high-performance signal processing products and solutions for a wide range of applications in industries such as automotive, communications, healthcare, and industrial. -
Application Field
The HMC717LP3E is commonly used in microwave communication systems, satellite communication systems, radar systems, medical imaging equipment, and test and measurement equipment. Its high frequency range, low phase noise, and high-quality performance make it ideal for applications requiring precise signal control and amplification at high frequencies. -
Package
HMC717LP3E is a leadless QFN package with a form factor of 3 mm x 3 mm. The package size of HMC717LP3E chip is 12-lead, 3x3mm QFN.
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