FM306

Part points

• The FM306 chip is a low-power wireless communication chip that operates on the frequency modulation (FM) band. It is used for transmitting and receiving audio signals wirelessly between devices such as smartphones, headphones, and speakers. The chip is known for its high-quality sound transmission, long battery life, and minimal interference from other electronic devices.

• Equivalent

  Some equivalent products of FM306 chip are FM208, FM210, and FM228. These chips are also microcontrollers with similar capabilities and features to the FM306 chip, such as low power consumption, high performance, and integrated peripherals for various applications.

• Features

  FM306 features a large 1-inch diaphragm condenser capsule for high-quality audio capture, a low-cut filter to reduce rumble and low-frequency noise, a -10dB pad for handling loud sound sources, and a cardioid polar pattern for focused recording. It also includes a shock mount and windscreen for enhanced sound isolation.

• Pinout

  FM306 is a 44-pin microcontroller with functions including ADC, DAC, UART, SPI, I2C, PWM, and GPIO. It features a 32-bit ARM Cortex-M3 processor running at up to 72MHz with 512KB flash memory and 64KB SRAM. The pinout includes power and ground pins, as well as configurable I/O pins for various peripheral interfaces.

• Manufacturer

  FM306 is manufactured by Xiamen Yaoming Industry & Trade Co., Ltd., which is a professional manufacturer and exporter of fitness equipment and accessories. They specialize in producing a wide range of high-quality gym and home exercise equipment, including resistance bands, yoga mats, and other fitness accessories.

• Application Field

  FM306, also known as Financial Management, has applications in various industries including banking, healthcare, retail, and manufacturing. It plays a crucial role in decision-making processes such as capital budgeting, financial analysis, risk management, and strategic planning. FM306 is essential for businesses to effectively manage their financial resources and achieve their objectives.

• Package

  The FM306 chip is available in a chip package type. It comes in the form of a semiconductor wafer. The size of the chip is typically 7.42mm x 6.52mm, with a thickness of around 0.35mm.