Intel EP4CGX150CF23I7

Part points

• The EP4CGX150CF23I7 is a field-programmable gate array (FPGA) chip from Intel's Cyclone IV GX series. It features 150,000 logic elements, 8 Mbits of RAM, 294 user I/O pins, and support for various interfaces. This chip is commonly used in applications requiring high-speed processing, such as telecommunications, industrial automation, and automotive electronics.

• Equivalent

  Some equivalent products of the EP4CGX150CF23I7 chip are Xilinx XC7A150T-1FGG676I, Altera 10M50DAF484C7G, and Lattice ECP5-5G. These chips offer similar capabilities in terms of logic density, performance, and features, making them suitable replacements for the EP4CGX150CF23I7 in various applications.

• Features

  EP4CGX150CF23I7 is a low-cost, general-purpose FPGA with 150K Logic Elements, 12.4 Mbits Embeded Memory, 180 Maximum User I/Os, and 297 Maximum User I/Os with OE. It offers low power consumption, high-speed performance, and flexibility for a wide range of applications.

• Pinout

  The EP4CGX150CF23I7 is a 484-pin FPGA (Field-Programmable Gate Array) from Intel (formerly Altera). It offers high-speed serial connectivity, DSP blocks, and programmable I/O (Input/Output). This device provides a versatile platform for a wide range of applications, such as telecommunications, industrial automation, and image processing.

• Manufacturer

  The EP4CGX150CF23I7 is manufactured by Intel Corporation. It is an American multinational corporation that is known for designing and manufacturing a wide range of semiconductor products, including microprocessors, chipsets, network interface controllers, and programmable logic devices like the EP4CGX150CF23I7. Intel is one of the largest and most influential companies in the technology industry.

• Application Field

  The EP4CGX150CF23I7 FPGA from Intel is commonly used in applications such as telecommunications, industrial automation, automotive, and aerospace. It is suitable for high-speed data processing, signal processing, and control systems due to its versatile architecture and high-performance capabilities.

• Package

  The EP4CGX150CF23I7 chip is in a FBGA (Fine-pitch Ball Grid Array) package, with a grid of balls on the underside for soldering. It is in the form of an integrated circuit and has a size of 23mm x 23mm.