Altera EP4CGX110DF31I7N

Part points

• The EP4CGX110DF31I7N is a Field-Programmable Gate Array (FPGA) chip from Intel (formerly Altera) designed for high-performance applications. It features 110,000 logic elements, embedded memory blocks, and high-speed transceivers for efficient processing and communication. This chip is commonly used in telecommunications, networking, and industrial automation industries.

• Equivalent

  Some equivalent products of the EP4CGX110DF31I7N chip are EP4CGX110DF31C7, EP4CGX110DF27I7N, EP4CGX110DF27C7N, and EP4CGX110DF27C6N. These chips belong to the same family of Altera Cyclone IV GX FPGAs and provide similar features and capabilities.

• Features

  EP4CGX110DF31I7N is a low-cost FPGA with 110K logic elements, 4740 Kbits embedded RAM, and 338 user I/Os. It features up to 464 embedded multipliers and on-chip PLLs for clock management. It also has low power consumption, making it suitable for a wide range of applications.

• Pinout

  The EP4CGX110DF31I7N is a 324-pin FPGA (Field-Programmable Gate Array) with 110,592 logic elements, 5,760 Kbits of embedded memory, and 266 I/O pins. Its functions include processing and storing data, implementing custom logic functions, and interfacing with external devices through the I/O pins.

• Manufacturer

  The EP4CGX110DF31I7N is manufactured by Intel Corporation. Intel is a multinational technology company specializing in the design and manufacture of various computer hardware, software, and semiconductor products. They are one of the largest and most well-known companies in the tech industry, known for their processors, memory chips, and other electronic components.

• Application Field

  The EP4CGX110DF31I7N is commonly used in applications such as industrial automation, communication infrastructure, automotive, and consumer electronics. It is especially well-suited for high-performance computing, signal processing, and data communication tasks due to its high logic density and advanced features.

• Package

  The EP4CGX110DF31I7N chip comes in a Ball Grid Array (BGA) package with a form factor of 31x31 mm and a size of 31x31 mm.