Altera EP4CE75F23C8N

Part points

• The EP4CE75F23C8N chip is a field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It features 75,000 logic elements, 608 I/O pins, and 3.3V voltage. It is suitable for a wide range of applications in industries like telecommunications, automotive, and industrial automation due to its high performance and flexibility.

• Equivalent

  The equivalent products of the EP4CE75F23C8N chip are Altera Cyclone IV EP4CE series FPGAs found in the same EP4CE75F23C8N package, such as EP4CE75F23I7N, EP4CE75F23I7LN, EP4CE75F29C8N, and EP4CE75F29I7N. These chips have similar features, performance, and capabilities.

• Features

  - FPGA with 75,000 logic elements - 560 embedded memory blocks - 712 user I/Os - 4-phase DLLs for clock management - Supply voltage of 1.2V - Maximum operating frequency of 250MHz - 23,352 kbits of RAM - 12 global clocks Overall, the EP4CE75F23C8N is a versatile and powerful FPGA suitable for a wide range of applications.

• Pinout

  The EP4CE75F23C8N is a 752-pin FPGA (Field-Programmable Gate Array) with a C8 package. It has various functions including programmable logic blocks, memory blocks, and digital signal processing blocks. The pin count refers to the number of physical pins on the package for interfacing with external components.

• Manufacturer

  The EP4CE75F23C8N is manufactured by Altera Corporation, now a part of Intel Corporation. It is a semiconductor company that designs and manufactures programmable logic devices and associated software development tools. Altera/Intel offers a wide range of solutions for various applications such as automotive, industrial, telecommunications, and data centers.

• Application Field

  The EP4CE75F23C8N FPGA is suitable for various applications including automotive systems, industrial automation, communication equipment, medical devices, aerospace systems, and more. It can be used for implementing complex digital processing algorithms, signal processing, and control applications in a wide range of industries that require high performance and flexibility.

• Package

  The EP4CE75F23C8N chip comes in a 484-pin FineLine Ball Grid Array (FBGA) package. It has a form factor of 23 mm x 23 mm and a size of 400-ball grid array.