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Pedidos acima de

$5000
ganham $50 um desconto !

Intel EP4CE30F23C8N 48HRS

Field Programmable Gate Array FPGA EP4CE30F23C8N

ISO14001 ISO9001 DUNS

Marcas: Intel

Parte do fabricante #: EP4CE30F23C8N

Ficha de dados: EP4CE30F23C8N Ficha de dados (PDF)

Pacote/Caso: 484-BGA

Status RoHS:

Condição de estoque: 5.946 peças, novo original

Tipo de Produto: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Preços

*Todos os preços estão em USD

Quantidade Preço unitário Preço Externo
1 $19,195 $19,195
30 $18,353 $550,590

Em estoque: 5.946 PCS

- +

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EP4CE30F23C8N Descrição geral

The EP4CE30F23C8N is a field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It belongs to the Cyclone IV E series and features 30,000 logic elements (LEs), which are basic building blocks for implementing digital circuits. The "F23" designation indicates its speed grade, with performance characteristics specified by Intel. The "C8" suggests it comes in a ceramic package, while the "N" signifies a RoHS-compliant package.This FPGA supports various configurable features like digital signal processing (DSP) blocks, memory blocks, and embedded processors, making it suitable for a wide range of applications including telecommunications, industrial automation, and automotive systems. With its embedded hard intellectual property (IP) cores, developers can integrate functions such as memory controllers and PCIe interfaces, reducing design complexity and time to market. Its versatility, low power consumption, and cost-effectiveness make it a popular choice for designers seeking flexibility in their electronic systems

Características

The Cyclone IV device family offers the following features:

Low-cost, low-power FPGA fabric:

6K to 150K logic elements

Up to 6.3 Mb of embedded memory

Up to 360 1818 multipliers for DSP processing intensive applications

Protocol bridging applications for under 1.5 W total power

Cyclone IV GX devices offer up to eight high-speed transceivers that provide:

Data rates up to 3.125 Gbps

8B/10B encoder/decoder

8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface

Byte serializer/deserializer (SERDES)

Word aligner

Rate matching FIFO

TX bit slipper for Common Public Radio Interface (CPRI)

Electrical idle

Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-fly

Static equalization and pre-emphasis for superior signal integrity

150 mW per channel power consumption

Flexible clocking structure to support multiple protocols in a single transceiver block

Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1:

1, 2, and 4 lane configurations

End-point and root-port configurations

Up to 256-byte payload

One virtual channel

2 KB retry buffer

4 KB receiver (Rx) buffer

Cyclone IV GX devices offer a wide range of protocol support:

PCIe (PIPE) Gen 1 1, 2, and 4 (2.5 Gbps)

Gigabit Ethernet (1.25 Gbps)

CPRI (up to 3.072 Gbps)

XAUI (3.125 Gbps)

Triple rate serial digital interface (SDI) (up to 2.97 Gbps)

Serial RapidIO (3.125 Gbps)

Basic mode (up to 3.125 Gbps)

V-by-One (up to 3.0 Gbps)

DisplayPort (2.7 Gbps)

Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps)

OBSAI (up to 3.072 Gbps)

Up to 532 user I/Os

LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx

Support for DDR2 SDRAM interfaces up to 200 MHz

Support for QDRII SRAM and DDR SDRAM up to 167 MHz

Up to eight phase-locked loops (PLLs) per device

Offered in commercial and industrial temperature grades

Aplicativo

Altera’s new Cyclone® IV FPGA device family extends the Cyclone FPGA series leadership in providing the market’s lowest-cost, lowest-power FPGAs, now with a transceiver variant. Cyclone IV devices are targeted to high-volume, cost-sensitive applications, enabling system designers to meet increasing bandwidth requirements while lowering costs.

Especificações

Parâmetro Valor Parâmetro Valor
Series Cyclone® IV E Package Tray
Product Status Active Programmabe Not Verified
Number of LABs/CLBs 1803 Number of Logic Elements/Cells 28848
Total RAM Bits 608256 Number of I/O 328
Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BGA
Supplier Device Package 484-FBGA (23x23)

Envio

Tipo de envio Taxa de envio Tempo de espera
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 dias
Fedex FedEx $20.00-$40.00 (0.50 KG) 2-5 dias
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 dias
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 dias
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 dias
CORREIO AÉREO REGISTADO CORREIO AÉREO REGISTADO $20.00-$40.00 (0.50 KG) 2-5 dias

Tempo de processamento: A taxa de envio depende de diferentes zonas e países.

Pagamento

Termos de pagamento Taxa de mão
Transferência bancária Transferência bancária cobrar taxa bancária de US$ 30,00.
PayPal PayPal cobrar taxa de serviço de 4,0%.
Cartão de crédito Cartão de crédito cobrar taxa de serviço de 3,5%.
Western Union Western Union charge US.00 banking fee.
Grama de dinheiro Grama de dinheiro cobrar taxa bancária de US$ 0,00.

Garantias

1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.

2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.

Embalagem

  • produtos

    Etapa1 :produtos

  • Embalagem a vácuo

    Etapa2 :Embalagem a vácuo

  • Saco antiestático

    Etapa3 :Saco antiestático

  • Embalagem individual

    Etapa4 :Embalagem individual

  • Caixas de embalagem

    Etapa5 :Caixas de embalagem

  • etiqueta de envio com código de barras

    Etapa6 :etiqueta de envio com código de barras

Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.

Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.

Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.

Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.

  • ESD
  • ESD

Part points

  • The EP4CE30F23C8N is a field-programmable gate array (FPGA) chip from the Altera Cyclone IV series. It features 30,000 logic elements, 608 Kbits of RAM, and 288 multipliers. It is designed for applications in telecommunications, automotive, industrial automation, and more, offering high-performance and low power consumption.
  • Equivalent

    The equivalent products of EP4CE30F23C8N chip are Altera Cyclone IV EP4CE30F23C8, XC4VSX35-10FF668I, and EP4CE30F23I7.
  • Features

    EP4CE30F23C8N is a FPGA chip from the Cyclone IV family. It has 33,280 logic elements, 528 embedded memory blocks, and 363 I/O pins. It also features up to 360 embedded multipliers, dedicated memory interfaces, and high-speed transceivers for efficient data transfer. It is suitable for a wide range of applications, including communication, automotive, and industrial control.
  • Pinout

    EP4CE30F23C8N is a 484-pin FPGA that offers high performance and low power consumption. It features 30,144 logic elements, 780 Kbits of RAM, and 266 embedded multipliers. This FPGA is designed for applications that require high-speed processing and advanced system integration capabilities.
  • Manufacturer

    The manufacturer of EP4CE30F23C8N is Intel Corporation. It is a multinational semiconductor company that designs and manufactures a wide range of products, including programmable logic devices like field-programmable gate arrays (FPGAs). Intel Corporation is also known for its central processing units (CPUs) and other integrated circuits used in various electronic devices.
  • Application Field

    EP4CE30F23C8N is a versatile FPGA that can be used in various applications such as telecommunications, networking, automotive, industrial automation, and consumer electronics. It offers high performance, low power consumption, and reconfigurability, making it suitable for a wide range of designs needing customizable processing capabilities.
  • Package

    The EP4CE30F23C8N chip is packaged in an 896-pin Fine Line Ball Grid Array (FBGA), with a form factor of 23x23 mm. The size of the chip is 30,220 logic elements, 600Kbits of RAM, and 266 18x18 bit hardware multipliers.

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