Altera EP4CE115F29I7

Part points

• EP4CE115F29I7 is a field-programmable gate array (FPGA) chip from Intel Altera. It features 115,000 logic elements, 2,982 kilobits of embedded memory, and 480 user I/Os. With high-performance capabilities and flexibility for custom hardware designs, it is commonly used in applications such as telecommunications, industrial automation, and high-performance computing.

• Equivalent

  Some equivalent products of EP4CE115F29I7 chip include Altera Cyclone IV EP4CE115F29I7N, Intel Cyclone IV EP4CE115F29I7N, and Xilinx Spartan-6 XC6SLX150-3FGG484I. These chips are all relatively similar in terms of features and capabilities.

• Features

  - Cyclone IV FPGA with 115,264 logic elements - 29,920 Adaptive Logic Modules - 1,339 Kbits of memory - 8 PLLs - 396 18x18-bit multipliers - 622 user I/Os - High-performance, low-power 40-nm technology - Supports high-speed transceivers, PCIe, and DDR3 - Reliable for industrial and automotive applications

• Pinout

  The EP4CE115F29I7 is a FPGA with 115,000 logic elements, 622 user I/O pins, and 218 18x18 multiplier blocks. It has a total of 781 pins (484 user I/O pins, 218 multipliers I/O pins, and other I/O pins). The function of this FPGA is to provide programmable logic capabilities for various applications such as signal processing, encryption, and digital circuit design.

• Manufacturer

  The EP4CE115F29I7 is manufactured by Intel Corporation, an American multinational corporation specializing in semiconductor products, specifically programmable logic devices. Intel is known for its innovation in computer hardware and software technology, including microprocessors, memory chips, and programmable logic devices.

• Application Field

  The EP4CE115F29I7 is commonly used in applications such as digital signal processing, telecommunications, networking, automotive, and industrial automation. It is suitable for a wide range of high-performance applications that require complex programmable logic, high-speed data processing, and reliable system integration.

• Package

  The EP4CE115F29I7 chip is in a FBGA (Fine-Pitch Ball Grid Array) package with a size of 29mm x 29mm. It has a form factor of CSP (Chip Scale Package) and measures 115,200 logic elements.