Pedidos acima de
$5000Altera EP3C25F324I7N
High-Speed FPGA for Complex Desig
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marcas: Altera Corporation (Intel)
Parte do fabricante #: EP3C25F324I7N
Ficha de dados: EP3C25F324I7N Datasheet (PDF)
Pacote/Caso: FBGA-324
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 3.500 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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EP3C25F324I7N Descrição geral
EP3C25F324I7N is a part number for a Field-Programmable Gate Array (FPGA) manufactured by Altera Corporation (now Intel Corporation).
![ep3c25f324i7n ep3c25f324i7n](/files/uploads/product/b/ep3c25f324i7n20200422152007_2749.jpg)
Características
- 25,440 logic elements (LEs)
- 504 embedded memory blocks (MBs)
- 72 embedded 18 x 18 multipliers
- 4 phase-locked loops (PLLs)
- 316 user I/O pins
- Supports various I/O standards such as LVDS, SSTL, and HSTL
Aplicativo
- Communications
- Video and image processing
- Industrial automation and control
- Medical equipment
- Automotive systems
- Aerospace and defense
![Altera Corporation (Intel) Inventory Altera Corporation (Intel) Inventory](/files/uploads/inventory/altera/altera.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Name | EP3C25F324I7N | Product Type | Field-Programmable Gate Array (FPGA) |
Manufacturer | Intel (Altera) | Logic Elements | 25,000 |
Available I/Os | 179 | Embedded Memory | 356 Kbits |
Operating Voltage Range | 1.15V to 1.25V (core), 3.0V to 3.6V (I/O) | Operating Temperature | 0°C to +85°C |
Package / Case | 324-Pin BGA (Ball Grid Array) | Packaging | Tape & Reel, Tray, and other options |
feature-family-name | Cyclone® III | feature-process-technology | 65nm |
feature-maximum-number-of-user-i-os | 215 | feature-number-of-registers | |
feature-device-logic-cells | 24624 | feature-device-system-gates | |
feature-number-of-multipliers | 66 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 594 | feature-total-number-of-block-ram | 66 |
feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz | |
feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
feature-device-logic-units | 24624 | feature-device-number-of-dlls-plls | 4 |
feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
feature-dedicated-dsp | feature-pci-blocks | ||
feature-programmability | No | feature-maximum-internal-frequency-mhz | 437.5 |
feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 324 | feature-supplier-package | FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991 |
feature-svhc | Yes |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Peças Equivalentes
Para o EP3C25F324I7N componente, você pode considerar essas peças de reposição e alternativas:
Número da peça
Marcas
Pacote
Descrição
Número da peça : EP3C25E144C8N
Marcas :
Pacote : TQFP144
Descrição : ALTERA EP3C25E144C8N FPGA, Cyclone III, PLL, 82 I/O"s, 402MHz, 1.15V to 1.25V, QFP-144
Número da peça : EP3C25U256C8N
Marcas :
Pacote : BGA-256
Descrição : FPGA, CYCLONE III, 25K LE, 256UBGA Programmable Logic Type:FPGA; Logic IC function:FPGA; Logic IC family:Cyclone III; Logic IC Base Number:3; I/O lines, No. of:156;
Número da peça : EP3C25Q240C8N
Marcas :
Pacote : PQFP-240
Descrição : FPGA, CYCLONE III, 25K LE, 240PQFP
Número da peça : EP3C25F256I7N
Marcas :
Pacote : FBGA-256
Descrição : FPGA Cyclone® III Family 24624 Cells 437.5MHz 65nm Technology 1.2V
Número da peça : EP3C25F324C8N
Marcas :
Pacote : FBGA-324
Descrição : BGA bulk new, guarantee 90days FPGA
Part points
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The EP3C25F324I7N chip is a field-programmable gate array (FPGA) designed by Intel. It features 24,624 logic elements, 534 Kbits of RAM, and 193 I/O pins. This chip is commonly used in various applications such as telecommunications, data processing, and industrial automation due to its flexibility and customizable nature.
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Equivalent
Some equivalent products of EP3C25F324I7N chip are Altera Cyclone III EP3C25F324C6, Cyclone III EP3C25F324C8, and Cyclone III EP3C25F324I7. These chips come with similar features and capabilities, making them suitable replacements for the EP3C25F324I7N chip in certain applications. -
Features
1. 2,304 Logic Elements 2. 25,920 bits RAM 3. 288 Kbits User Flash memory 4. 4 PLLs, 8 DLLs 5. 4 SERDES channels 6. 266 user I/Os 7. Dual Configuration (Factory/Pin) 8. Low Power consumption 9. JTAG Debug Module 10. RoHS compliant -
Pinout
The EP3C25F324I7N is a FPGA with 324 pins. It is designed for complex applications requiring high performance, such as video or signal processing. The functions of the pins include I/O, power supply, configuration, and clock inputs. -
Manufacturer
The EP3C25F324I7N is manufactured by Intel Corporation. Intel Corporation is an American multinational corporation that designs and manufactures semiconductor chips and other technologies for a variety of computing and networking applications. They are one of the largest and most well-known technology companies in the world. -
Application Field
The EP3C25F324I7N is commonly used in applications such as communication systems, automotive electronics, industrial control systems, and medical devices. It is also utilized in consumer electronics, aerospace technology, and computer peripherals. Additionally, it is suitable for applications that require high-performance, low power consumption, and small form factor design. -
Package
The EP3C25F324I7N chip comes in a Ball Grid Array (BGA) package form. It has a size of 324 balls and a body size of 17 x 17 mm.
Ficha de dados PDF
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