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$5000
Altera EP2AGX45DF29C6N
Programmable gate array for flexible and scalable circuit design with 364 IOs
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Marcas: Altera Corporation (Intel)
Parte do fabricante #: EP2AGX45DF29C6N
Ficha de dados: EP2AGX45DF29C6N Ficha de dados (PDF)
Pacote/Caso: FBGA-780
Status RoHS:
Condição de estoque: 2.134 peças, novo original
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $416,167 | $416,167 |
200 | $161,051 | $32210,200 |
500 | $155,392 | $77696,000 |
1000 | $152,594 | $152594,000 |
Em estoque: 2.134 PCS
EP2AGX45DF29C6N Descrição geral
In conclusion, the EP2AGX45DF29C6N FPGA from Intel represents a superior choice for those seeking a powerful, adaptable, and efficient solution for their FPGA needs. With its extensive capabilities, including a high number of logic elements, substantial RAM, embedded multipliers, and support for high-speed transceivers, this FPGA is well-equipped to handle demanding applications across various industries. Its ease of programmability using Intel's Quartus Prime software, coupled with its support for multiple communication interfaces, further solidifies its position as a versatile and reliable FPGA option for diverse projects and applications
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Características
- Device family: Arria II GX
- Device density: 45,152 logic elements (LEs)
- Total RAM: 1,562 Kbits
- Total DSP blocks: 288
- Transceiver count: 24
- Maximum user I/O pins: 622
- Operating speed: up to 500 MHz
- Configuration: Dual configuration with remote update support
- Package: 780-pin FineLine BGA (Ball Grid Array)
Aplicativo
- High-performance digital signal processing (DSP) applications
- Wireless communication systems
- Broadcast and professional video processing
- Industrial automation and control
- Test and measurement equipment
- Military and aerospace systems
- Medical imaging and instrumentation
- Networking and data center applications
![Altera Corporation (Intel) Inventory Altera Corporation (Intel) Inventory](/files/uploads/inventory/altera/altera.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
feature-family-name | Arria® II GX | feature-process-technology | 40nm |
feature-maximum-number-of-user-i-os | 364 | feature-number-of-registers | |
feature-device-logic-cells | 42959 | feature-device-system-gates | |
feature-number-of-multipliers | 232 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 3435 | feature-total-number-of-block-ram | 319 |
feature-ethernet-macs | 1 | feature-supported-ip-core | 10/100/1000Mbps Full Duplex Ethernet MAC|Hashing IP Core (BA413)|IP Compiler for PCI Express x8 (Soft IP)|10/100/1G Ethernet MACController (GMAC)|Video LVDS SerDes Transmitter / Receiver |
feature-supported-ip-core-manufacture | Microtronix Inc/Mobiveil, Inc/CAST, Inc/Barco Silex/MorethanIP | feature-maximum-number-of-serdes-channels | 28 |
feature-device-logic-units | 42959 | feature-device-number-of-dlls-plls | 4 |
feature-transceiver-blocks | 8 | feature-transceiver-speed-gbps | 6.375 |
feature-dedicated-dsp | 29 | feature-pci-blocks | 1 |
feature-programmability | Yes | feature-maximum-internal-frequency-mhz | 400 |
feature-speed-grade | 6 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | HSTL-12|HSTL-15|HSTL-18|LVDS|LVPECL | feature-single-ended-i-o-standards-supported | LVCMOS|LVTTL |
feature-external-memory-interface | QDRII+SRAM|RLDRAM II|DDR3 SDRAM|DDR2 SDRAM|DDR SDRAM | feature-minimum-operating-supply-voltage-v | 0.87 |
feature-maximum-operating-supply-voltage-v | 0.93 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 780 | feature-supplier-package | FC-FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991 |
feature-svhc |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The EP2AGX45DF29C6N chip is a high-performance field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It belongs to the Arria II GX family of FPGAs and offers a range of features like high-speed transceivers, memory interfaces, and digital signal processing (DSP) blocks. It is suitable for a variety of applications, including communications, video processing, and high-speed data processing.
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Equivalent
There are no direct equivalent products to the EP2AGX45DF29C6N chip. Each chip has its own set of unique features and specifications, making it difficult to find a direct replacement. However, you may consider looking for alternative chips from the same manufacturer or exploring other options within the same performance range. -
Features
EP2AGX45DF29C6N is a high-performance field-programmable gate array (FPGA) with a capacity of 45,036 logic elements. It features a 1.5V core voltage, a maximum clock frequency of 300MHz, and supports various memory interfaces such as DDR3, DDR2, and QDRII+. This FPGA also has built-in DSP blocks and high-speed transceivers for communication applications. -
Pinout
The EP2AGX45DF29C6N is an FPGA (Field Programmable Gate Array) device. It has 29,440 LEs (logic elements) and 1.43 Mbits of embedded memory. The pin count and functions of the EP2AGX45DF29C6N can vary depending on the specific packaging option chosen, as well as the device family and variant. Therefore, it is necessary to refer to the datasheet for the specific pin count and function details. -
Manufacturer
The manufacturer of the EP2AGX45DF29C6N is Intel Corporation. It is an American multinational technology company that designs, manufactures, and sells computer components, including programmable logic devices like the EP2AGX45DF29C6N. Intel is widely recognized for its processors and other semiconductor products used in various industries. -
Application Field
The EP2AGX45DF29C6N is a field-programmable gate array (FPGA) that can be used in a variety of applications such as telecommunications, industrial automation, high-performance computing, and military and aerospace systems. With its high processing power and flexible programmability, it can be tailored to meet the specific requirements of these different application areas. -
Package
The EP2AGX45DF29C6N chip comes in a Ball Grid Array (BGA) package type with a 29mm x 29mm form factor.
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