Renesas 9FGL0451CKILFT

Part points

• The 9FGL0451CKILFT is a high-performance clock generator IC designed for use in a variety of electronic devices. It features four independent output banks, each with programmable frequency and phase adjustments. This chip offers low jitter and high frequency accuracy, making it ideal for applications requiring precise timing control.

• Equivalent

  Some equivalent products of the 9FGL0451CKILFT chip are the IDT8TG1001-19LK, IDT8T49N10110, and IDT8T49N242. These chips are all high-performance clock generators designed for use in networking, computing, and telecommunications applications.

• Features

  9FGL0451CKILFT is a Low-Power HCSL Clock Buffer with 9 configurable outputs. It has low additive jitter, low skew, and best in class power consumption. It operates at a frequency up to 333.34 MHz and has individual output enables for dynamic output disable.

• Pinout

  The 9FGL0451CKILFT is a clock generator with a pin count of 32. It generates up to 12 different output frequencies and has an integrated EEPROM for storing configuration settings. Functions include clock distribution, fanout buffering, and frequency synthesis for high-performance applications.

• Manufacturer

  9FGL0451CKILFT is manufactured by IDT (Integrated Device Technology), which is a semiconductor company specializing in timing, signal integrity, and power management solutions for a variety of industries including communications, computing, and consumer electronics. IDT's products are integral to enabling high-performance systems in applications such as networking, data centers, wireless infrastructure, automotive, and industrial markets.

• Application Field

  The 9FGL0451CKILFT is commonly used in high-speed networking applications such as routers, switches, and optical transport equipment. It is also used in data storage systems, test equipment, and computing systems where high-frequency clock distribution is required for reliable operation.

• Package

  The 9FGL0451CKILFT chip comes in a 32-VFQFN Exposed Pad package type. It is in the form of a surface mount IC (Integrated Circuit) and has a size of 4mm x 4mm.