Intel 5CEFA4F23I7N

Part points

• The 5CEFA4F23I7N chip is a field-programmable gate array (FPGA) from Intel's Cyclone V series. It features a compact design with high performance and low power consumption, making it ideal for a wide range of applications such as communication systems, industrial automation, and automotive electronics. Its flexibility and reconfigurability make it suitable for both prototyping and production environments.

• Equivalent

  The equivalent products of 5CEFA4F23I7N chip are Lattice Semiconductor 5CEFA4F23I7N, Xilinx Spartan-3E XC3S200 FPGA, Altera MAX V 5M570ZT100 FPGA, and Microchip PIC18F4550 MCU. These products offer similar features and capabilities for FPGA and MCU applications.

• Features

  The 5CEFA4F23I7N is a field-programmable gate array (FPGA) from the Cyclone V series by Intel. It features 4,272 Logic Elements, 106,560 Adaptive LUTs, and 2,713 Kbits of RAM. It also includes high-speed transceivers for data transfer and supports various communication protocols such as PCIe and DDR3.

• Pinout

  The pin count of 5CEFA4F23I7N is 144. It is a Field Programmable Gate Array (FPGA) with 17,280 Logic Elements, 288 Logic Array Blocks, and 504 User I/Os. It is commonly used for digital signal processing, industrial automation, and communication applications.

• Manufacturer

  The manufacturer of 5CEFA4F23I7N is Intel Corporation, an American multinational corporation that produces computing and communication components, such as microprocessors, memory chips, and other hardware. Intel is one of the world's largest and highest-valued semiconductor chip makers, known for its innovation in the tech industry.

• Application Field

  1. Telecommunications: 5CEFA4F23I7N can be used for high-speed data transmission in telecom networks. 2. Renewable energy: It can enhance the efficiency and reliability of renewable energy systems. 3. Industrial automation: 5CEFA4F23I7N can improve monitoring and control processes in industrial automation. 4. Healthcare: It can be utilized in medical devices for data transmission and communication. 5. Defense and aerospace: 5CEFA4F23I7N can be implemented in communication systems for defense and aerospace applications.

• Package

  The 5CEFA4F23I7N chip comes in a FG (FineLine BGA) package, with a 484-ball form factor. The size of the chip is 17 x 17 mm.