Pedidos acima de
$5000Intel 5CEBA9F23C7N
FPGA Cyclone® V E Family 301000 Cells 28nm Technology 1.1V 484-Pin FBGA Tray"
Marcas: Intel Corp
Parte do fabricante #: 5CEBA9F23C7N
Ficha de dados: 5CEBA9F23C7N Datasheet (PDF)
Pacote/Caso: FBGA-484
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 3.236 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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5CEBA9F23C7N Descrição geral
Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 14251008 301000 484-BGA
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
feature-family-name | Cyclone® V E | feature-process-technology | 28nm |
feature-maximum-number-of-user-i-os | 224 | feature-number-of-registers | 454240 |
feature-device-logic-cells | 301000 | feature-device-system-gates | |
feature-number-of-multipliers | 684 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 12200 | feature-total-number-of-block-ram | 1220 |
feature-ethernet-macs | 2 | feature-supported-ip-core | |
feature-supported-ip-core-manufacture | feature-maximum-number-of-serdes-channels | ||
feature-device-logic-units | 301000 | feature-device-number-of-dlls-plls | 8 |
feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
feature-dedicated-dsp | 342 | feature-pci-blocks | |
feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | LVPECL|LVDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS |
feature-external-memory-interface | DDR2 SDRAM|DDR3 SDRAM|LPDDR2 | feature-minimum-operating-supply-voltage-v | 1.07 |
feature-maximum-operating-supply-voltage-v | 1.13 | feature-packaging | Tray |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 484 | feature-supplier-package | FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991 |
feature-svhc | No |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The 5CEBA9F23C7N is a field-programmable gate array (FPGA) chip developed by Altera (now Intel). It features 9,000 logic elements, 217 Kbits of RAM, and 270 user I/Os. This chip offers a versatile and customizable platform for designing digital circuits, making it suitable for a wide range of applications such as telecommunications, automotive, and industrial automation.
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Equivalent
Some equivalent products of 5CEBA9F23C7N chip are 5CEBA9F23C7N, 5CEBA9F15C8N, 5CEBA9F23I7N, 5CEBA9F23A7N, and 5CEBA9F23L7N. These chips are part of the Cyclone V series from Intel-Altera and offer similar features and performances to the 5CEBA9F23C7N chip. -
Features
The 5CEBA9F23C7N is a low-power FPGA with 9256 logic elements, 292KB RAM, and 360Kbits of configuration memory. It has 432 multipliers, 32818 adaptive logic modules, and supports up to 266 user I/Os. It features integrated PLLs, gigabit transceivers, and advanced power management capabilities. -
Pinout
The 5CEBA9F23C7N is a 484-pin FPGA with 302 user I/Os. It is designed for high-performance applications and features a mix of logic elements, memory blocks, and digital signal processing (DSP) blocks. The FPGA can be used for a variety of applications such as communications, networking, and industrial automation. -
Manufacturer
The manufacturer of 5CEBA9F23C7N is Intel Corporation, an American multinational corporation known for its semiconductor chips and related technologies. Intel is one of the largest and most influential companies in the technology industry, providing a wide range of products and services for computer hardware and software. -
Application Field
- Telecommunications: Used in mobile networks for improved signal processing capabilities. - Automotive: Utilized in advanced driver assistance systems, autonomous driving, and infotainment systems. - Industrial automation: Enables precise control and monitoring in factories and industrial processes. - Healthcare: Applied in medical imaging equipment for diagnostics and treatment planning. - Aerospace: Used in avionics systems for enhanced communication and navigation. -
Package
The 5CEBA9F23C7N chip comes in a Ball Grid Array (BGA) package, with a form factor of 17mm x 17mm. It has a size of 256-ball, 0.8mm pitch.
Ficha de dados PDF
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos
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