Intel 5CEBA2F23C8N

Part points

• The 5CEBA2F23C8N chip is a field-programmable gate array (FPGA) manufactured by Altera, now part of Intel. It features 23,260 logic elements, 743Kbits of embedded memory, and supports high-speed transceivers for communication applications. This chip is commonly used in a variety of industrial, automotive, and networking applications for its flexibility and programmability.

• Equivalent

  Some equivalent products of the 5CEBA2F23C8N chip include Altera (now Intel) MAX V CPLD series and Xilinx CoolRunner-II CPLD series. These chips offer similar features such as low power consumption, high performance, and logic capacity for various programmable logic applications.

• Features

  Some features of 5CEBA2F23C8N are: 1. Logic elements: 8,500 2. Embedded memory: 378 Kb 3. Embedded multiplier: 57x18-bit 4. Maximum number of user I/Os: 360 5. Transceiver: 4x 6.144 Gbps These features make it suitable for a wide range of applications including communications, industrial automation, and automotive.

• Pinout

  The 5CEBA2F23C8N is a Cyclone V FPGA with 1508 pins. It is designed to provide high-speed serial interface options, embedded transceivers, and low-power consumption for cost-sensitive applications. The specific pin functions can vary depending on the design implemented in the FPGA.

• Manufacturer

  The 5CEBA2F23C8N is manufactured by Intel Corporation. Intel is an American multinational corporation that develops and manufactures a wide range of computer processors, integrated circuits, and other semiconductor products. They are one of the leading technology companies in the world, known for their innovation and advanced technology solutions.

• Application Field

  The 5CEBA2F23C8N can be used in a wide range of applications such as industrial automation, automotive, communication systems, consumer electronics, and medical devices. Its compact design, low power consumption, and high performance make it suitable for various embedded and digital signal processing applications.

• Package

  The 5CEBA2F23C8N chip comes in a Ball Grid Array (BGA) package with a form factor of 1152-FFBGA (29x29). It has a size of 29mm x 29mm and contains 65,002 logic elements.