Panelizing identical PCBs into a larger sheet increases both PCB production and SMT assembly efficiency. It is generally recommended to panelize boards smaller than 5*5 cm.

Single Pieces: This means that the file you uploaded has already been panelized, and we will manufacture according to the provided file.

Panelized Board: This means that the file you uploaded contains individual boards, and Ovaga will handle the panelization. The panelization method can either be specified by you or Ovaga can offer a suitable recommendation.

The thickness of finished board. Board thickness tolerance is +/-10%.

The PCB solder mask color. The green standard has the best performance and fastest turnaround time. For most colors, the silkscreen is printed white. Only for white solder mask, the silkscreen is printed black.

ENIG (Electroless Nickel Immersion Gold) offers high flatness and is relatively more expensive, making it suitable for complex boards.

HASL (Hot Air Solder Leveling) is easier to solder but has lower flatness, suitable for standard boards.

OSP (Organic Solderability Preservative) meets environmental requirements, and the minimum board size must be 8*5 cm.

Blind Via refers to a via that connects the outer layer to the inner layer but does not go through the entire board.

uried Via refers to a via located within the inner layers, invisible from the top or bottom layers, used for internal signal connections.

If a single file contains multiple different boards, whether connected via stamp holes, slots, or V-cuts, or shipped separately as individual boards, they are all considered as part of a panelization process, and a combined panelization fee will be charged.

If the file is designed with multiple individual boards that are not connected, to prevent issues such as missing boards, we do not accept CNC-routing separate boards from a single file. The boards must be shipped as a connected panel.

Please ensure that the correct number of designs is filled in. If there are multiple slightly different designs in one file, it can be difficult for us to accurately identify the number of designs. If the order specifies only 1 design, but the file contains 2 or more, Ovaga will process the order based on the specified number and will not be responsible for errors due to incorrect design count selection.

Panelizing identical PCBs into a larger sheet increases both PCB production and SMT assembly efficiency. It is generally recommended to panelize boards smaller than 5*5 cm.

Single Pieces: This means that the file you uploaded has already been panelized, and we will manufacture according to the provided file.

Panelized Board: This means that the file you uploaded contains individual boards, and Ovaga will handle the panelization. The panelization method can either be specified by you or Ovaga can offer a suitable recommendation.

The commonly used size for the process edge is 5mm, with a minimum size of 3mm.

The board thickness refers to the finished thickness of the PCB.

The board thickness is closely related to the price, and customers are advised to decide the thickness themselves.

It refers to the finished copper thickness of the outer layer.

The solder mask color refers to the surface color of the PCB's solder mask layer. It is recommended to choose the standard green, as selecting other colors may affect the price and lead time.

Slight color variations in the solder mask may occur between different production batches, which is considered normal.

Please note, for single-sided boards, the solder mask is only applied to the circuit side by default, while the other side will expose the base material. For special requests, please include a note.

For double-sided bare boards, both sides will be without solder mask by default, exposing the base material. For special requests, please include a note.

It refers to the silkscreen color. When the solder mask is white, the corresponding silkscreen is black. For all other solder mask colors, the silkscreen will be white. No other silkscreen colors are offered.

This refers to the PCB surface finish. Ovaga offers: leaded HASL, lead-free HASL, ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservative). A small portion of HASL boards may be produced together with ENIG boards, as ENIG has significantly higher costs and better pad flatness than HASL, with no performance issues. Additionally, a small portion of leaded HASL boards may be produced together with lead-free HASL boards. If you do not accept this, please note that the process cannot be changed.

You need to provide the impedance value, impedance trace width/spacing, impedance layer, reference layer, and an image showing the exact location of the impedance traces on the PCB. Please package this information together with the PCB file and upload them.

If impedance is required but not selected when placing the order, it will be considered that the impedance requirement has been ignored.

Gold fingers are the gold-plated columns along the connecting edges of PCBs. Only when ENIG surface finish is chosen, the fingers will be gold-plated. If you choose HASL surface finish, we will use HASL as edge connect plating.

For edge connector boards (finger boards), the board edges are chamfered for easy insertion and removal. The default chamfer angle is 45°, and this process is aligned with the surface finish of the pads.

This option applies only if the file contains edge connectors (fingers). If this option is selected but the file does not include edge connectors, Ovaga will not be responsible for any resulting quality issues.

The chamfered edge process requires the length and width dimensions to be within the range of 4-28 cm.

For edge connectors with chamfer requirements, the solder mask at the connector area will be opened by default.

Metallized Half-Hole refers to a process where a metallized hole is made into a half-hole, with half of the drilled hole or slot inside the board and the other half extending beyond the board's edge. After forming, the wall of the slot or hole remains copper-plated.

The diameter of half-holes must be ≥0.5mm.

The spacing between half-holes must be ≥0.9mm.

It refers to metallized edge plating, meaning the edges of the board are to be metalized.

A via located on a pad is called a via-in-pad. After filling the via with resin, an additional layer of copper is plated (POFV). If there are other vias that require ink filling, Ovaga will uniformly treat them with resin filling.

The standard for via tenting with ink is that the vias should not accumulate solder when passing through the soldering process. Red marks at the via openings and the occasional presence of small solder balls are considered normal.

The standard for via filling with ink is that no white light should pass through the vias when held up to light. For vias with a diameter of ≥0.45mm, it is normal for the ink filling to be incomplete.

For resin-filled vias, the filling must be complete, without voids, and light should not pass through.

When the designed BGA pad is smaller than 0.25mm, the pad is too small for flying probe testing, which means you must accept the risk of not being able to ensure the integrity of the circuit network. However, this issue does not occur if a test fixture is used for testing.

Impedance tolerance: ±10% (For multilayer boards, Ovaga will provide a specified lamination structure. If impedance requirements involve inner-layer connections, please confirm if the design meets your needs. Outer-layer impedance will be manufactured according to the design specifications in the file.) If impedance is required but not selected when placing the order, it will be considered that the impedance requirement has been ignored.

Carbon ink refers to the ink printed on the surface of the PCB that provides good electrical conductivity.

100% full testing is performed before shipment. Prototype orders include free testing, while batch orders use a test fixture for testing.